Digi brings Windows CE to ARM and Wireless networks

Digi International announced that it is the first company to offer a development kit with board support package (BSP) for Microsoft's recently released Windows Embedded CE version 6.0 for ARM processors and integrated wireless networking. BSPs are now available for Digi's ARM-based ConnectCore 9C and Wi-9C modules, with integrated wired and wireless networking support, as part of Digi's new range of Jump Start Development Kits (JSK).

Digi's new JSKs are designed to speed up the process of ARM-based embedded development with an emphasis on affordability and usability. Each JSK includes all hardware, software and tools required to complete development of an embedded product including the module itself. The JSK for Windows Embedded CE 6.0 also includes 180-day evaluation copies of Microsoft Visual Studio development system and Windows Embedded CE 6.0. The JSKs are now available at an introductory price of US$399.

Digi, a Microsoft Embedded Gold Partner, has been at the forefront of providing solutions for embedded developers to create designs based on Microsoft products.

"Digi is far ahead of the curve by already implementing a real-world solution based on Windows Embedded CE 6.0," said Ilya Bukshteyn, director of Windows Embedded Marketing in the Mobile and Embedded Devices Division at Microsoft Corp. "The company has a record of helping make embedded design based on Microsoft products easy and affordable for design engineers."

"We at Digi are dedicated to ensuring we offer support for Microsoft embedded operating systems as quickly as possible after they are released," stated Joel Young, CTO and Vice President of Research & Development at Digi. "There is a great deal of demand from our customers to offer support for Microsoft's systems, as its embedded offerings have proven to be very effective in the past."

Jump Start Development Kits for Windows Embedded CE 6.0 with support for other Digi modules including the ConnectCore XP Intel® XScale® based processor will be made available in the coming months.