Kingmax announces "invisible" RAM heatsink

While other premium memory makers are appealing to the gadget-senses with comb-shaped heatsinks, thermal sensors and flickering light shows, Kingmax has decided to buck the trend with what it calls an "invisible" heatsink.

Instead of sticking a heatsink on the modules, the company has instead coated the chips with a silicon thermal compound. As with the thermal compound you usually spread between a chip and a heatsink, Kingmax says that it "fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly."

Kingmax hasn't revealed any details about the compound, other than describing it as "nano-sized", which sounds like an attempt to jump on the latest marketing buzzword bandwagon to us. Kingmax says it works "like a sponge, [which] pulls the heat and releases [it] into the air at a faster rate than [the] normal product by itself."

In addition to coating the chips with the substance, Kingmax also claims that the compound could be mixed into the resin used in the packaging around the chips, which it says would improve thermal dissipation further.

With the DDR3 modules coated in the invisible goo, Kingmax says that they can be safely overclocked to beyond 2,400MHz, with a CAS latency of 10, and that you won't need any extra fans.

However, even if the compound does move heat from the modules more efficiently than a heatsink, that heat still has to go somewhere afterwards, so you'll still need some airflow unless you want that heat festering inside your case.

Kingmax says that the memory was "developed for enthusiasts, gamers and benchmarkers," so Kingmax's "nano-sized thermal dissipation compound" needs to be genuinely effective if it's going to impress these folks.

There's no information on pricing or availability yet, but Kingmax says that the modules were designed for Intel's P55 chipset and that they will be available in 4GB (2x 2GB) dual-channel kits.