What Will Hide Under iPhone 5’s Hood?

Apple’s upcoming iPhone 5 will continue its predecessor’s tradition and be lighter and thinner than previous models. In order to reduce the smartphone’s weight and thickness, Apple must upgrade some of its hardware components.

Tech website LightReading has speculated on what will be in the guts of the iPhone 5 handset.

Baseband Chipset: if Apple chooses Qualcomm’s MDM6600 chipset, it is likely one iPhone 5 model will be compatible with AT&T’s and Verizon’s Wireless HSPA+ and 3G CDMA networks. Or Apple may well choose an Infineon HSPA+ chip, TechInsight’s Steve Bitton suggests.

Processor: Apple’s A5 is most likely to power the iPhone 5, but its manufacturer is unknown. Taiwan Semiconductor Manufacturing Co could be a possible choice for Apple with its 28nm technology, though Apple will probably stick to Samsung with its 45nm processors.

Connectivity: the Broadcom BCM4330 chipset for Wi-Fi, Bluetooth and FM connectivity could also be part of the iPhone 5’s hardware, Bitton forecasts.

Camera: Omnivision is expected to supply Apple with camera sensors and offer a new 8MP camera. This would be a most welcome improvement, since the iOS smartphone has been rather crippled because of its limited camera capabilities.

Display: recent patents Apple has registered for OLED screens could mean the iPhone 5 will integrate a larger display, maybe even an edge-to-edge display, with lower battery consumption.