This year’s Common Platform Technologies Forum will see Samsung Electronics, IBM and Global Foundries showcase a selection of their finest future silicon technologies, with the forum to take place at the Santa Clara Convention Center on March 14th.
The three companies have collaborated to develop Common Platform technology – described by IBM officials as the world’s biggest chip-making consortium. Samsung, IBM and Global Foundries will also be addressing next-generation semiconductor innovations that cover topics including 14-, 20- and 28-nanometre processes as well as various innovations that are beyond 14nm plus 450mm wafer manufacturing.
General manager of IBM’s microelectronics division, Michael Cadigan, explained: “The Common Platform alliance is built on an unmatched legacy of invention and deep commitment to research and development from IBM,” as reported by Tech Week Europe UK.
Samsung Electronics, IBM and Global Foundries as well as more than 20 other technology outfits are the driving forces behind these new technologies which are likely to revolutionise the industry in a completely new direction.
The soon to be held Forum will have keynote addresses made by industry leaders as well as presentations to be delivered by Common Platform partners’ managements and senior members from a wide range of technical teams .Leave a comment on this article