The Inside Of The New iPad Has Changed, But Not By Much

The new iPad reached not only to customers eager to test its high resolution display but also to tech fanatics who couldn't wait to tear it apart in order to uncover its secrets. The recent teardown revealed the new iPad's inner parts and allowed a comparison with the iPad 2.

The first internal difference is due to the new chip. When Apple decided on the A5X, the engineers from the Cupertino headquarters decided to move away from PoP (Package-on-Package) design to a SoC (System on Chip) model. The third generation iPad also features two small DRAM devices, unlike its predecessor. The two items are 512MB Elpida LP-DDR2 devices. Elpida is quite elusive with its products and the two devices with the B4064B2MA-8D-F codename are no exception.

Anandtech's Anand Lal Shimpi however attempts a translation of the cryptic name. "The first character in the part number ("B") tells us that we're looking at mobile/low-power DDR2 memory. The next two characters ("40") typically refer to the device density, the 4 in this case likely means 4Gbit while the 0 is a bit odd since it usually refers to DRAM page-size. It's the fourth and fifth characters that are a bit odd to me ("64"). Usually these tell us the width of the DRAM interface, the 64 would imply something that doesn't appear to be true."

Source: Apple Insider