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Intel Unveils USB 3.0 Chip Specifications, Plans Product Releases next year

Intel has made public the draft specifications for its Super Speed USB 3.0 chip, which is capable of transferring data at an amazing speed of 4.8 Gbps (ed: Expect real speeds to be much less), and said to consume lower power than its predecessor USB 2.0.

The company has published details of revision 0.9 for its Extensible Host Controller Interface (xHCI), which would assist the USB 3.0 host controllers in communicating with the USB 3.0 software assembly.

The chip is developed with an aim to provide excellent interoperability within various devices, which would remarkably help in designing software support for the market.

This move from the computer chip giant has provided a sigh of relief to its competitors - AMD and Nvidia, as common xHCI specifications would help the market in delivering high-quality content to its end users.

Expressing his satisfaction on this move from Intel, AMD’s VP and GM for its Chipset Unit, Phil Eisler said, “USB 3.0 is an answer to future the bandwidth need of the PC platform”, and mentioned AMD’s support for common xHCI specifications.

USB 3.0 products are expected to hit the market in 2009.

Désiré Athow
Désiré Athow

Désiré has been musing and writing about technology during a career spanning four decades. He dabbled in website building and web hosting when DHTML and frames were en vogue and started writing about the impact of technology on society just before the start of the Y2K hysteria at the turn of the last millennium. Following an eight-year stint at ITProPortal.com where he discovered the joys of global tech-fests, Désiré now heads up TechRadar Pro. Previously he was a freelance technology journalist at Incisive Media, Breakthrough Publishing and Vnunet, and Business Magazine. He also launched and hosted the first Tech Radio Show on Radio Plus.