In deal which is likely to put the willies up intel, AMD fab spin-off GlobalFoundries and Qualcomm today announced a "non-binding" memorandum of understanding to collaborate on 45nm Low Power (LP) and 28nm (LP) technologies with an intended collaboration on future advanced process nodes.
Intel may rule the desktop and notebook roost but in the future most of us will be accessing the Interweb from our handhelds and its here that the chipmaker faces its biggest challenge.
According to the announcement, GlobalFoundries will begin churning Qualcomm designs at Fab 1 in Dresden in 2010.
Jim Clifford, SVP and GM of operations at Qualcomm CDMA Technologies reckoned, GlobalFoundries "well positioned to help us enable the next generation of wireless innovation."
According to Clifford, Qualcomm’s Integrated Fabless Manufacturing (IFM) model builds tight technical interfaces among all parties in the semiconductor development cycle, delivering greater efficiency, lower costs and quicker time to market for new products.
A crucial component of the Qualcomm’s IFM strategy is a multi-foundry approach, which helps assure product supply to Qualcomm’s device manufacturing customers and provides the company flexibility to meet rapidly changing demands.
The IFM model is designed to accelerate Qualcomm’s technology execution and to meet what the pair say will be exponential growth in the wireless semiconductor market. The intended relationship with GlobalFoundries will focus on Qualcomm’s wireless businesses and provide technologies for handheld products that operate on the CDMA2000, WCDMA and 4G/LTE cellular standards, including the emerging smartbook device segment.
In a statement, Douglas Grose, GloFo's CEO said: “By bringing the benefits of a leading-edge IDM model to the foundry world, we provide customers with the fastest option to get advanced products to market in volume and at mature yield. We’re pleased to have an opportunity to collaborate with a market leader like Qualcomm as they enable new classes of wireless products and technologies for the future.”
In addition to advanced technology nodes, the two companies intend to explore other areas to collaborate on such as die-package interaction and 3D packaging technologies.