Intel has already integrated a truck-load of components into its EP80579 system-on-chip (SoC) architecture, but the silicon-centric company has also revealed that it plans to integrate 3G features into future SoCs, which will be aimed at the smartphone market.
Speaking at the Intel investors' conference in Santa Clara yesterday, Intel’s CEO Paul Otellini said, "Our intent is to actually have a 3G solution to be able to put on our SoCs over time."
Intel revealed its 'Moorestown' Atom chip for the smartphone market earlier this month, which introduced the concept of an x86 processor in smartphones. The platform includes a 45nm Atom Z6xx processor, integrated graphics and memory and display controllers in a SoC design.
However, the integration of 3G features into a single chip along with everything else could potentially enable Intel to take on ARM in the smartphone business.
"Right now, we’re working with various 3G vendors," said Otellini, "you know, making the apps processor and the comms processor, which is the right strategy for now." However, he then added, "In the period of, say 2014-2015, we will have to have solutions that allow us to integrate [3G].”"
This silicon integration, according to Otellini, will enable Intel to drive that SoC even into the smartphone segments.