Chinese telecoms device makers Huawei announced their upcoming series of mobile products for the quarter at MWC in Barcelona, with the IDEOS X3 phone, IDEOS S7 tablet, E586 MIFI and the HiLink E173 dongle.
Huawei’s Ideos X3 mobile phone arrives with a 3.2-inch HVGA touch screen, with a 3.2 megapixel camera whilst running from the Android ‘Gingerbread’ 2.3 OS. The X3 also has the thinnest chassis in their range to date, with the company’s over-the-air-upgrade solution for the Google mobile OS as a part of the handset.
The S7 tablet is a 7-inch capacitive touch screen, with both 3G and WIFI capabilities whilst being only 12.5mm thin.
Huawei HiLink E173 mobile broadband dongle is their latest product in the portfolio, which boasts an ‘up and running time’ of 15 seconds.
The next Huawei mobile WiFI Smart Pro device builds upon the success of their already popular Three MIFI devices. One Mobile Ring believes this, along with the HiLink product could be arriving with Three this year.
Huawei’s HiLink and Smart Pro will be available between April and June, with the Ideos S7 arriving in April although the X3 only seems to be arriving in Japan in the Spring.
Originally published at OneMobileRing.com