Chip maker giant plans to dish out the development kit for its new Thunderbolt data transfer technology this quarter.
Thunderbolt, which is only available in Apple's new range of Mac notebooks, comes with a high speed, dual channel peripheral that allows data transfer between laptops and external storage devices at speeds of 10 Gbps.
Intel had worked with Apple to integrate the technology with its new line of Mac laptops. According to the company, the Thunderbolt SDK kit will allow partner manufacturers to roll out products with Thunderbolt capabilities much more quickly.
The company is already working with several partners to develop products to populate the Thunderbolt ecosystem. Companies like Canon, BlackMagic, Matroz, AJA have pledged support for the new data transfer technology along with Sony. Computer maker Hewlett Packard said it would decide whether to support Thunderbolt only after a thorough evaluation of the technology.
Intel also plans to include USB 3.0 support along with Thunderbolt in its upcoming Ivy Bridge line of processors which will be launched in 2012 as a successor to the Sandy Bridge processors.
"Intel is going to support USB 3.0 in the 2012 client platform. We're going to support Thunderbolt capability. We believe they're complementary," said Kirk Skaugen, a vice president at the Intel Architecture Group, said during a developer conference in Beijing.