Chip maker Intel confirmed yesterday that it is going ahead with its decision to include both USB 3.0 as well as the new Thunderbolt technology in its Ivy Bridge chipset, likely to be launched in 2012.
Co-incidentally, this announcement came from the tech giant on the same day when the USB Association also revealed about its arch-rival AMD’s decision to incorporate USB 3.0 into its A75 and A70M Fusion chipsets.
"Intel is going to support USB 3.0 in the 2012 client platform. We're going to support Thunderbolt capability. We believe that they're complementary." Kirk Sakaugen, vice-president of the Intel Architecture Group said in a statement at Intel's developer conference in Beijing.
With these revelation made, the Ivy Bridge chipset is now confirmed to be the first of its kind that will offer native support for both USB 3.0 and the Thunderbolt technology.
The USB 3.0 technology is approximately ten times faster than the USB 2.0. However, with an impressing speed of 4.8Gbps, it appears more of a dwarf in comparison to what the Thunderbolt technology offers with its 10Gbps speed on a single cable.
Intel’s Thunderbolt data transfer technology first appeared in Apple’s latest line-up of Mac computers.