As September approaches, all sorts of wild speculation about how the iPhone 5 will look have emerged; apart from the claims that the company wants to ship 25 million units of the latest version by the end of the year, new rumours about Foxconn finding it hard to build the new iPhone have emerged.
According to the Wall Street Journal, sources close to the manufacturing process are saying that Foxconn is currently unable to improve yield rates because the phone is "complicated and difficult to assemble."
More specifically, the phone is said to be thinner and lighter than the iPhone 4, which previous rumours have no really mentioned until now.
Anyway, it will be a huge challenge for Apple to produce a smartphone that is both lighter than its predecessor, thinner and comes with a bigger screen as some sources have suggested before.
Cutting the iPhone 5's mass may be achieved by swapping Intel's Infineon baseband chips for more integrated ones from Qualcomm and employing the same battery technology as the iPad 2.
But beyond this, there's little that can physically be done to save a few more grams or slash the thickness of the iPhone 5 by a millimeter or two.
Another rumour that has emerged over the last 24 hours is that component manufacturers have been told to send the key components for the iPhone 5 to Foxconn and other key ODMs in August.