Semiconductor specialist Invensas has announced that it plans to demonstrate a novel new way of creating multi-die chips with similar performance characteristics as single-die chips, meaning future memory modules could be significantly more capacious.
The company's claims centre around a technology it calls xFD, or multi-die face-down packaging. While Invensas promises that it scales to many dies in a single logical package, it hasn't got quite that far yet: instead, it will be demonstrating the first implementation of a dual face-down package at the Intel Developer Forum in San Francisco next month.
The technology centres around a wirebond packaging system which mounts integrated circuits upside-down and staggers them in a similar way to tiles on a roof, which reduces the length of wirebonds to keep performance as close to a single-die package as possible.
As a result, the company claims, manufacturers can expect a decrease of 25 to 35 per cent in vertical height over conventional solutions, allowing those on a restricted size budget - such as smartphone and tablet makers - to cram more components into the same space, or make their devices even thinner.
DFD and xFD aren't the first solutions to the problem of increasing component density: the concept of a dual-die package, or DDP, was filed as a patent application for Siliconware Precision Industries back in 2000 and granted in 2002. Invensas claims that xFD is different, however, and offers between a 20 and 30 per cent heat transfer improvement over DDP technology.
The company also makes the claim that xFD costs less to manufacture than other multi-die DRAM solutions currently available, thanks to its parallel process flow reducing gold and other material usage and its use of existing wirebond assembly lines with no new construction hardware required.
"We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices," explained Simon McElrea, president of Invensas. "xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption."
Should the company's xFD packaging technology catch on - and scale to multiple dies in the way that the company suggests - it could spell a massive boost in storage and memory capacity for mobile devices, and also prove its worth in the server environment where the demand for higher-density DRAM modules is always high.
Products based around the DFD packaging technology will be on display at the Invensas booth at IDF, the company has confirmed.