IBM is planning to debut a new collaborative attempt with material manufacturers to deliver three dimensional computer chips which will be far more complicated than all the products floating around in the market today.
The company stated this week that it is looking forward to designing microchips comprising of 100 chip layers staked together. According to IBM, the stacking of chips will eventually make all sorts of electronic items function at a higher speed and in a more power-efficient manner.
It is noteworthy that three dimensional chips have already made their way into some state-of-the-art products. However, the chips suffer from some serious drawbacks such as an expensive production methodology, and overheating.
"Today's chips, including those containing 3D transistors, are in fact 2D chips that are still very flat structures," explained Vice President of IBM Research, Bernie Meyerson, a vice president of IBM Research in a statement announcing the partnership between Big Blue and 3M, as reported in The Register.
“We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low,” he added.