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Chips in iPhone 5 Successors To Be Fabbed By TSMC

Apple will move away from Samsung Electronics for the next two iterations of its A-series system on chips, the A6 and the A7, which are scheduled to be launched in 2012 and 2013 respectively.

According to Ingrid Lee writing for Digitimes (opens in new tab) says that Apple and Taiwan Semiconductor Manufacturing Company (TSMC) have penned a foundry partnership agreement which will provide Apple with 28nm and 20nm processes.

It has been widely predicted that Apple would have moved away from Samsung Electronics after the two tech giants have started to step on each other's toes with competing products.

The added fact that Apple & Samsung have been suing and counter suing each other means that they will probably never be good friends again. TSMC has apparently managed to negotiate a good price which will allow it to keep its gross profit margin in line with its current average of 45 per cent.

Digitimes also notes that Apple will probably need to split orders for the backend packaging - at least in the short term - because of TSMC's limited capacity for assembling the SoC itself.

It's worth noting that TMSC is also working on a 3D chip technology similar to Intel's Trigate technology but won't introduce it when its 14nm process goes live.

Désiré Athow
Contributor

Désiré has been musing and writing about technology during a career spanning four decades. He dabbled in website building and web hosting when DHTML and frames were en vogue and started writing about the impact of technology on society just before the start of the Y2K hysteria at the turn of the last millennium. Following an eight-year stint at ITProPortal.com where he discovered the joys of global tech-fests, Désiré now heads up TechRadar Pro. Previously he was a freelance technology journalist at Incisive Media, Breakthrough Publishing and Vnunet, and Business Magazine. He also launched and hosted the first Tech Radio Show on Radio Plus.