At the beginning of 2011, Intel and Micron's joint manufacturing venture NAND (IMFT) announced that they had produced a 64Gb (8GB) MLC NAND on a 20nm process. Many IMFT NAND used in SSDs are made by using a 25nm process.
The reason behind using this process is that it reduces die size which eventually reduces the overall cost in manufacturing.
Intel and Micron have recently started a second generation 20nm part at a 128Gb with 16GB capacity, which also signifies the continuation of their successful partnership.
The 128Gb 20nm MLC NAND features ONFi 3 interface rather than the ONFI 2.x which was used earlier in the 64Gb and older 25nm parts, as reported by AnandTech.
What makes the new ONFI 3 special is that it enhances interface bandwidth from a maximum of 200MT/s (IMFT 25nm was limited to 166MT/s) to around 333MT/s.
All in all we can expect high powered performance from this new joint effort by Intel and Micron. Joint ventures, when successful, can provide a platform for innovation and imagination that allows engineers and others to experiment and discover new ways to design and develop technology and equipment.