Sony - the Japanese electronic giant that supplies camera modules to Apple for its massively popular iPhone 4s, has unveiled a new smaller, generation-next CMOS image sensor.
Apparently, the new technology could eventually result with Apple having to come up with even thinner iPhone models in the foreseeable future.
Sony announced the new complementary metal-oxide-semiconductor (CMOS) image sensor on Monday. Basically, the new product is a back illuminated model designed to provide users with superior quality images - more compact in size, reports PCMag.
The company also bragged that the arrival of this new sensor will facilitate future cameras an excellent platform on which to evolve. It will be interesting to see this evolution.
It is worth noting here that camera components used in the iPhone 4S happen to be product's thickest internal component. It is a known fact that the 8 megapixel camera used in the iPhone 4S presented some rather tough design challenges to the company. In fact, it was the driving factor behind Apple's decision to retain the same form factor in the product as its older sibling, iPhone 4.