The Samsung Galaxy S3, the heir to the Galaxy S2, will apparently be a mere 7mm thick, according to a report published by Korean news outlet ETNews.
Samsung Electronics has reportedly managed to cut the thickness of the printed circuit boards and other electronics components by a massive 20 per cent.
We're not sure whether the Galaxy S3 will use the same trick as the S2; the latter was 9mm thick at its thinnest point but had an unsightly bulge at the back. In comparison, the iPhone 4S is flat and 9.3mm thick.
The phone was expected to be launched at Mobile World Congress in Barcelona at the end of this month, but Samsung has already confirmed that this won't be the case.
Instead, the S3 will be unveiled at a separate event to avoid the "noise" of MWC, where journalists will be handpicked and flown in.
The smartphone is expected to be a quad core handset or based on a dual core Cortex-A15 based chipset, with an HDMI port, a super-sized HD ready Super AMOLED touchscreen and Ice Cream Sandwich.
Expect the rest of its configuration to be similar to the S2; a fat battery, 1GB RAM, 16 to 32GB onboard storage, a microSD card slot and an eight (or 12) megapixel camera.