A new alternative to portable storage could be transparent, bringing with it a whole host of advantages over traditional solutions.
Discussed at the National Meeting and Exposition of the American Chemical Society, the new material is said to use a 3-D internal architecture and is capable of sustaining incredibly hostile environments - including temperatures of up to 1,000 degrees Fahrenheit - while retaining the data held on it.
"These new chips are really big for the electronics industry because they are now looking for replacements for flash memory," said James M. Tour, Ph.D., who led the research team behind the development of the new memory type.
He believes that thanks to the flexible nature of the memory and its small form factor, the transparent solution would be very attractive to developers of smartphones and mobile computer manufacturers.
Originally thought to require the 'miracle material' Graphene, it's now been discovered that it's not necessary. The main component in the production of this new memory type is silicon oxide.
Due to the transparent nature of this storage medium, the developers believe it could see the location of storage within devices change, from being within the main body to being part of the display itself. By storing information just under the surface of the screen it provides additional interior space for other components, as a way to reduce the overall thickness of the product.
This new memory type has been patented and it is said that the creators are currently discussing with manufacturers about its future uses.