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After HTC One X, Does HTC One S Also Suffer From Design Flaw?

After the screen flex issue affecting the HTC One X and reported by one tech website, another newly released HTC phone, the One S, seems to suffer from design issues.

According to three separate websites - XDA-developers, MoDaCo and Eurodroid - the smartphone's ceramic enclosure chips and cracks in normal usage.

The chassis is created using a process called microarc oxidation or MAO and produces a surface that HTC claims is four times harder than anodized aluminium, something the company says, makes a case redundant.

Ceramic is hard but also suffers from the fact that it is brittle and some have claimed that the chipping might be due to the flexible aluminium underneath, which also expands when heated (for example by the heat generated by the baseband chipset or the processor).

In addition, Eurodroid pointed out that the phone's chassis is discoloured easily with the review sample sent to the website turning from black to light grey.

Source : MoDaCo (opens in new tab), EuroDroid (opens in new tab), XDA-Developers (opens in new tab)

Désiré Athow
Contributor

Désiré has been musing and writing about technology during a career spanning four decades. He dabbled in website building and web hosting when DHTML and frames were en vogue and started writing about the impact of technology on society just before the start of the Y2K hysteria at the turn of the last millennium. Following an eight-year stint at ITProPortal.com where he discovered the joys of global tech-fests, Désiré now heads up TechRadar Pro. Previously he was a freelance technology journalist at Incisive Media, Breakthrough Publishing and Vnunet, and Business Magazine. He also launched and hosted the first Tech Radio Show on Radio Plus.