Details about another new iPhone component have reportedly been leaked, thanks to photos from a WeiPhone forum user, who posted images of the next-gen iPhone's motherboard/logicboard.
As 9to5Mac reported, the photos were posted by the same person behind the legitimate iPhone 4S motherboard leak in August 2011.
User guojun1984 published photos on the forum showing the front and back of the logicboard, which appears to be a prototype, 9to5Mac pointed out, due to the lack of typical labeling on the pieces. The photos show a SIM card slot, which seems to be slightly smaller than its 4/4S predecessor. They boast closely set connection points, which could mean the company is implementing the new Nano-SIM format.
Another change comes in the form of the battery connector, which appears to have five pins, compared to the previous devices' four pins.
According to recent reports, the new iPhone is expected to get a battery bump, pushing it up to a capacity of 1440 mAh, 10 mAh higher than the iPhone 4S . The increase will provide a slightly higher battery life, though it will be more quickly drained by the possible addition of 4G LTE on the new iDevice.
The addition of LTE for the first time in iPhone history has not been confirmed, but the photos provide evidence of more antenna connections, which could mean the LTE rumours are indeed true.
Apple did not immediately respond to a request for comment.
The still-unnamed iPhone has been fodder for rumours since May, when photos surfaced on the Web providing a sneak peak at the possible taller and thinner new handset. In late May, reports of a larger screen were corroborated when the purported design schematic of the new phone's front panel was posted online.
While Apple has not confirmed any rumours about the next-gen phone, reports suggest that Apple will unveil the device on 12 September, with a possible release nine days later, on 21 September.