Samsung's fabs are now cranking out eMMC 5.0 memory modules — billed as the "world's fastest embedded memory" — for next-generation smartphones and tablets, the South Korean tech giant said.
Volume production has started for 11.5 x 13mm eMMC 5.0 devices in 16GB, 32GB, and 64GB densities, Samsung said, adding that the small package size makes the modules "ideal for mobile devices where space on the printed circuit board is extremely limited."
Samsung's new, ultra-fast mobile DRAM comes with an integrated NAND controller and firmware to accelerate typical mobile device tasks.
"With timely mass production of our ultra-fast eMMC PRO lineup offering a more than 10x performance increase over external memory cards, Samsung will accelerate the spread of high-end mobile devices as the market for devices with larger screens and more multimedia functionality expands even further," Samsung's vice president of memory marketing, KyongMoo Mang, said in a statement.
"We will continue to provide advanced mobile memory solutions that allow users to enjoy high definition, large-volume content seamlessly, as we also strengthen technological cooperation with mobile devices manufacturers."
How fast are the new DRAM devices? Samsung said the 32GB and 64GB versions have random read and random write speeds of 7,000 inputs/outputs per second (IOPS) and deliver a sequential read rate of 250MB/s and a sequential write rate of 90MB/s. That's 10 times the sequential read/write speeds provided by class 10 external memory cards, the company noted.
Samsung didn't offer numbers for the 16GB eMMC PRO device itis currently producing at volume.
The new memory chips "will enable much faster multi-tasking, Web-browsing, application downloading, and file transfers, as well as high-definition video capture and playback, and are highly responsive to running large-file gaming and productivity applications," the company said.
Samsung's eMMC PRO products are based on the company's 64GB 10-nanometer class NAND flash technology which was designed for semiconductor fabrication processes between the 10nm and 20nm process nodes.